Multichip Modules And Related Technologies

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Multichip Modules And Related Technologies

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Author : Gerald L. Ginsberg
language : en
Publisher: McGraw-Hill Companies
Release Date : 1994

Multichip Modules And Related Technologies written by Gerald L. Ginsberg and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.

Multichip Modules

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Author :
language : en
Publisher: Ishm
Release Date : 1994

Multichip Modules written by and has been published by Ishm this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Technology & Engineering categories.

Multichip Modules

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Author : R. Wayne Johnson
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 1991

Multichip Modules written by R. Wayne Johnson and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.

This volume provides the information essential for making the right decisions required for new equipment design.

Multichip Module Technology Handbook

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Author : Philip E. Garrou
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998

Multichip Module Technology Handbook written by Philip E. Garrou and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.

MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.

Thermal Management Handbook For Electronic Assemblies

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Author : Jerry E. Sergent
language : en
Publisher: McGraw Hill Professional
Release Date : 1998

Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Science categories.

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Multi Chip Module Conference

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Author : IEEE
language : en
Publisher:
Release Date : 1992

Multi Chip Module Conference written by IEEE and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with categories.

Multichip Module Technologies And Alternatives The Basics

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Author : Daryl Ann Doane
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27

Multichip Module Technologies And Alternatives The Basics written by Daryl Ann Doane and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

The International Journal Of Microcircuits And Electronic Packaging

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Author :
language : en
Publisher:
Release Date : 1997

The International Journal Of Microcircuits And Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electronic packaging categories.

Electronic Connector Handbook

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Author : Robert S. Mroczkowski
language : en
Publisher: McGraw Hill Professional
Release Date : 1998

Electronic Connector Handbook written by Robert S. Mroczkowski and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.

Includes data on connectors, this handbook covers the basic functions of connectors and details the range of electronic connectors. It discusses connector parameters in an application context to expedite implementation, and provides design and materials selection criteria for the range of connectors.

Modern Solder Technology For Competitive Electronics Manufacturing

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Author : Jennie S. Hwang
language : en
Publisher: McGraw Hill Professional
Release Date : 1996

Modern Solder Technology For Competitive Electronics Manufacturing written by Jennie S. Hwang and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.

Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.