Multi Chip Module Conference

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Proceedings

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Author :
language : en
Publisher:
Release Date : 1997

Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electronic packaging categories.

Multi Chip Module Conference

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Author : IEEE
language : en
Publisher:
Release Date : 1992

Multi Chip Module Conference written by IEEE and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with categories.

Ieee Multi Chip Module Conference

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Author :
language : en
Publisher:
Release Date : 1997

Ieee Multi Chip Module Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with categories.

Multi Chip Module Test Strategies

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Author : Yervant Zorian
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Multi Chip Module Test Strategies written by Yervant Zorian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Multi Chip Module Conference

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Author :
language : en
Publisher:
Release Date : 1994

Multi Chip Module Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with categories.

Multichip Module Technologies And Alternatives The Basics

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Author : Daryl Ann Doane
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27

Multichip Module Technologies And Alternatives The Basics written by Daryl Ann Doane and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Proceedings

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Author : IEEE Circuits and Systems Society
language : en
Publisher:
Release Date : 1997

Proceedings written by IEEE Circuits and Systems Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Multichip modules (Microelectronics) categories.

Conceptual Design Of Multichip Modules And Systems

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Author : Peter A. Sandborn
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-14

Conceptual Design Of Multichip Modules And Systems written by Peter A. Sandborn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-14 with Technology & Engineering categories.

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

Physical Design For Multichip Modules

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Author : Mysore Sriram
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Physical Design For Multichip Modules written by Mysore Sriram and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

1995 International Conference On Multichip Modules

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Author :
language : en
Publisher:
Release Date : 1995

1995 International Conference On Multichip Modules written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Technology & Engineering categories.