Multichip Module Technology Handbook

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Multichip Module Technology Handbook

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Author : Philip E. Garrou
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998

Multichip Module Technology Handbook written by Philip E. Garrou and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.

MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.

Thermal Management Handbook For Electronic Assemblies

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Author : Jerry E. Sergent
language : en
Publisher: McGraw Hill Professional
Release Date : 1998

Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Science categories.

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Low Cost Flip Chip Technologies

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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2000

Low Cost Flip Chip Technologies written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Business & Economics categories.

Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.

Handbook Of Semiconductor Technology Processing Of Semiconductors

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Author :
language : en
Publisher:
Release Date : 2000

Handbook Of Semiconductor Technology Processing Of Semiconductors written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Electronic structure categories.

Handbook Of Semiconductor Technology Volume 2

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Author : Kenneth A. Jackson
language : en
Publisher: Wiley-VCH
Release Date : 2000-08-15

Handbook Of Semiconductor Technology Volume 2 written by Kenneth A. Jackson and has been published by Wiley-VCH this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-08-15 with Medical categories.

Semiconductor technology is the basis of today's microelectronics industry with its many impacts on our modern life, i.e. computer and communication technology. This two-volume handbook covers the basics of semiconductor processing technology, which are as essential for the design of new microelectronic devices as the fundamental physics. Volume 1 'Electronic Structure and Properties' covers the structure and properties of semiconductors, with particular emphasis on concepts relevant to semiconductor technology. Volume 2 'Processing of Semiconductors' deals with the enabling materials technology for the electronics industry. World-renowned authors have contributed to this unique treatment of the processing of semiconductors and related technologies. Of interest to physicists and engineers in research and in the electronics industry, this is a valuable reference source and state-of-the-art review by the world's top authors.

Electronics Manufacturing

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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2002-09-13

Electronics Manufacturing written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-09-13 with Technology & Engineering categories.

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives

Fundamentals Of Device And Systems Packaging Technologies And Applications Second Edition

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Author : Rao Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2019-11-20

Fundamentals Of Device And Systems Packaging Technologies And Applications Second Edition written by Rao Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-20 with Technology & Engineering categories.

A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field

Chip Scale Package Csp

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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 1999

Chip Scale Package Csp written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.

Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.

Handbook Of Fine Pitch Surface Mount Technology

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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1994

Handbook Of Fine Pitch Surface Mount Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.

Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.

Inside Spice

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Author : Ron M. Kielkowski
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998

Inside Spice written by Ron M. Kielkowski and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Computers categories.

This is a guide to the SPICE simulation program which provides practical methods for generating simulations that are fast, accurate and convergent. The accompanying CD features a Windows-compatible version of RSPICE, the author's simulator, which can be used to model circuits.