Introduction To Multichip Modules

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Introduction To Multichip Modules

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Author : Naveed A. Sherwani
language : en
Publisher: Wiley-Interscience
Release Date : 1995-11-23

Introduction To Multichip Modules written by Naveed A. Sherwani and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-11-23 with Computers categories.

Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.

An Overview Of Multichip Modules

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Author :
language : en
Publisher:
Release Date : 1994

An Overview Of Multichip Modules written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with categories.

This report provides a high-level tutorial on the electronics packaging technology known as multichip modules (MCMs). The terminology associated with MCM development is explained in words which can be understood by personnel who do not have a background in electronics packaging techniques. The technology is introduced with a brief synopsis of the MCM history and market, proceeding into an in-depth discussion of interconnect substrates, Known-good- die issues, chip attachment technologies, and testing/rework methods. The report concludes with a look at the fledgling industry infrastructure that supports MCM development, the high-speed chips that are used in MCM designs, the software support required, and the future of MCMs. Although by no means a comprehensive treatment of these subjects, this report provides the basics essential to an understanding of current state-of-the-art high-density electronics packaging. This information should be particularly beneficial to personnel involved in the development of miniaturized signal and data processors.

Multichip Modules And Related Technologies

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Author : Gerald L. Ginsberg
language : en
Publisher: McGraw-Hill Companies
Release Date : 1994

Multichip Modules And Related Technologies written by Gerald L. Ginsberg and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.

Multichip Modules

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Author : R. Wayne Johnson
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 1991

Multichip Modules written by R. Wayne Johnson and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.

This volume provides the information essential for making the right decisions required for new equipment design.

Multichip Modules

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Author :
language : en
Publisher: Ishm
Release Date : 1994

Multichip Modules written by and has been published by Ishm this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Technology & Engineering categories.

Multi Chip Module Conference

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Author : IEEE
language : en
Publisher:
Release Date : 1992

Multi Chip Module Conference written by IEEE and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with categories.

Fundamentals Of Microsystems Packaging

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Author : Rao Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2001-05-08

Fundamentals Of Microsystems Packaging written by Rao Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-05-08 with Technology & Engineering categories.

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Proceedings 1996 International Conference On Multichip Modules

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Author :
language : en
Publisher:
Release Date : 1996

Proceedings 1996 International Conference On Multichip Modules written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.

Introduction To Electronics Design

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Author : Ferdinand Haverman Mitchell (Jr.)
language : en
Publisher:
Release Date : 1992

Introduction To Electronics Design written by Ferdinand Haverman Mitchell (Jr.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Technology & Engineering categories.

Handbook Of Tape Automated Bonding

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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1992

Handbook Of Tape Automated Bonding written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Computers categories.

Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field.