Electronic Packaging And Production
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Manufacturing Challenges In Electronic Packaging
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Author : Y.C. Lee
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-12-31
Manufacturing Challenges In Electronic Packaging written by Y.C. Lee and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-31 with Science categories.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date : 1971
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1971 with Electronic apparatus and appliances categories.
Manufacturing Challenges In Electronic Packaging
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Author : Y C Lee
language : en
Publisher:
Release Date : 1997-12-31
Manufacturing Challenges In Electronic Packaging written by Y C Lee and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-31 with categories.
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date : 1996
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Electronic apparatus and appliances categories.
The Electronics Assembly Handbook
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Author : Frank Riley
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
The Electronics Assembly Handbook written by Frank Riley and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Technology & Engineering categories.
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Electronic Equipment Packaging Technology
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Author : Gerald L. Ginsberg
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Electronic Equipment Packaging Technology written by Gerald L. Ginsberg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Science categories.
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Proceedings Of The Technical Program 2nd National Electronic Packaging And Production Conference
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Author :
language : en
Publisher:
Release Date :
Proceedings Of The Technical Program 2nd National Electronic Packaging And Production Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date :
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date :
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.