Electronic Equipment Packaging Technology
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Electronic Equipment Packaging Technology
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Author : Gerald L. Ginsberg
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Electronic Equipment Packaging Technology written by Gerald L. Ginsberg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Science categories.
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Solder Paste In Electronics Packaging
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Author : Jennie S. Hwang
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Solder Paste In Electronics Packaging written by Jennie S. Hwang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Social Science categories.
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Ieee International Electronic Manufacturing Technology Symposium
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Author :
language : en
Publisher:
Release Date :
Ieee International Electronic Manufacturing Technology Symposium written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Electronic apparatus and appliances categories.
Surface Modification Technologies Xiv
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Author : T. S. Sudarshan
language : en
Publisher: CRC Press
Release Date : 2001
Surface Modification Technologies Xiv written by T. S. Sudarshan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Science categories.
Special Technology Area Review On Electronics Packaging
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Author :
language : en
Publisher:
Release Date : 1993
Special Technology Area Review On Electronics Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with categories.
Electronic packaging technology dictates the cost, performance and reliability of almost all future commercial and military electronics equipment. These equipments will be the marketable products of an electronics industry which is projected to grow to 2.0 trillion dollars by the year 2000. A strong and growing dependency exists between our national defense capability and this electronics industry. Electronic packaging has traditionally been a shared responsibility of several industry sectors and specialty vendors. The packaging of integrated circuits constitutes a significant fraction of the product value provided by the device manufacturer, and additional value is added by circuit board specialists, frame manufacturers, subsystem and system assemblers, cable and connector companies and others involved in packaging the electronic equipments. New packaging technologies, which utilize minimally protected die of increasing complexity and fine line integrating substrates to achieve higher packaging densities, are reshaping the contributions of the various industry sectors. Each involved industry sector, including defense electronics, recognizes these changes and is adjusting to retain a significant future packaging role. However, the resulting plans and investments of both industry and government are unbalanced and lack coherence. DoD, with its strong and growing dependence on electronics, should, in its planning, coordination, and cooperative efforts, undertake to unify the various defense and industry efforts into a coherent plan that responds efficiently to the defined needs for electronic packaging. This report makes specific recommendations for (1) a coordinated plan for industry and defense, (2) significant augmentation of specific packaging technologies, (3) market initiative assistance, and (4) a timely response.
Multichip Modules And Related Technologies
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Author : Gerald L. Ginsberg
language : en
Publisher: McGraw-Hill Companies
Release Date : 1994
Multichip Modules And Related Technologies written by Gerald L. Ginsberg and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.
Advances In Embedded And Fan Out Wafer Level Packaging Technologies
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Author : Beth Keser
language : en
Publisher: John Wiley & Sons
Release Date : 2019-02-20
Advances In Embedded And Fan Out Wafer Level Packaging Technologies written by Beth Keser and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-20 with Technology & Engineering categories.
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Electronics
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Author :
language : en
Publisher:
Release Date : 1983
Electronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983 with Electronics categories.
Who S Who In Technology
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Author :
language : en
Publisher:
Release Date : 1986
Who S Who In Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986 with Engineers categories.