Manufacturing Challenges In Electronic Packaging
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Manufacturing Challenges In Electronic Packaging
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Author : Y.C. Lee
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-12-31
Manufacturing Challenges In Electronic Packaging written by Y.C. Lee and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-31 with Science categories.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Manufacturing Challenges In Electronic Packaging
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Author : Y C Lee
language : en
Publisher:
Release Date : 1997-12-31
Manufacturing Challenges In Electronic Packaging written by Y C Lee and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-31 with categories.
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Automation In Manufacturing And Miniaturization In Size New Challenges For Electronic Packaging
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Author : SEMICON Europa
language : en
Publisher:
Release Date : 1998
Automation In Manufacturing And Miniaturization In Size New Challenges For Electronic Packaging written by SEMICON Europa and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.
Manufacturing Aspects In Electronic Packaging 1993
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Author : American Society of Mechanical Engineers. Winter Annual Meeting
language : en
Publisher:
Release Date : 1993
Manufacturing Aspects In Electronic Packaging 1993 written by American Society of Mechanical Engineers. Winter Annual Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date : 1995
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electronic apparatus and appliances categories.
Ieee Cpmt International Electronic Manufacturing Technology Symposium Proceedings
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Author :
language : en
Publisher:
Release Date : 1995
Ieee Cpmt International Electronic Manufacturing Technology Symposium Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electronic apparatus and appliances categories.
Advances In Embedded And Fan Out Wafer Level Packaging Technologies
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Author : Beth Keser
language : en
Publisher: John Wiley & Sons
Release Date : 2019-02-12
Advances In Embedded And Fan Out Wafer Level Packaging Technologies written by Beth Keser and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-12 with Technology & Engineering categories.
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Advances In Electronic Packaging
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Author :
language : en
Publisher:
Release Date : 2001
Advances In Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Electronic packaging categories.
Automation In Manufacturing And Miniaturization In Size
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Author : Semiconductor Equipment and Materials International
language : en
Publisher:
Release Date : 1998
Automation In Manufacturing And Miniaturization In Size written by Semiconductor Equipment and Materials International and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Microelectronic packaging categories.
Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.