Area Array Interconnection Handbook

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Area Array Interconnection Handbook

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Author : Karl J. Puttlitz
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Area Array Interconnection Handbook written by Karl J. Puttlitz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Area Array Packaging Handbook

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Author : Ken Gilleo
language : en
Publisher: McGraw Hill Professional
Release Date : 2002

Area Array Packaging Handbook written by Ken Gilleo and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Business & Economics categories.

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Electronic Packaging And Interconnection Handbook

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Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Companies
Release Date : 1991

Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.

Semiconductor Manufacturing Handbook

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Author : Hwaiyu Geng
language : en
Publisher: McGraw Hill Professional
Release Date : 2005-05-18

Semiconductor Manufacturing Handbook written by Hwaiyu Geng and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-05-18 with Technology & Engineering categories.

WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

Electronic Packaging And Interconnection Handbook 4 E

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Author : Charles A. Harper
language : en
Publisher: McGraw Hill Professional
Release Date : 2005

Electronic Packaging And Interconnection Handbook 4 E written by Charles A. Harper and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.

Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Semiconductor Manufacturing Handbook 2e Pb

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Author : Hwaiyu Geng
language : en
Publisher: McGraw Hill Professional
Release Date : 2017-10-06

Semiconductor Manufacturing Handbook 2e Pb written by Hwaiyu Geng and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-10-06 with Technology & Engineering categories.

Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities. •Nanotechnology and microsystems manufacturing •FinFET and nanoscale silicide formation •Physical design for high-performance, low-power 3D circuits •Epitaxi, anneals, RTP, and oxidation •Microlithography, etching, and ion implantations •Physical, chemical, electrochemical, and atomic layer vapor deposition •Chemical mechanical planarization •Atomic force metrology •Packaging, bonding, and interconnects •Flexible hybrid electronics •Flat-panel,flexible display electronics, and photovoltaics •Gas distribution systems •Ultrapure water and filtration •Process chemicals handling and abatement •Chemical and slurry handling systems •Yield management, CIM, and factory automation •Manufacturing execution systems •Advanced process control •Airborne molecular contamination •ESD controls in clean-room environments •Vacuum systems and RF plasma systems •IC manufacturing parts cleaning technology •Vibration and noise design •And much more

Proceedings

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Author :
language : en
Publisher:
Release Date : 2000

Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Electronic apparatus and appliances categories.

Multichip Module Technology Handbook

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Author : Philip E. Garrou
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998

Multichip Module Technology Handbook written by Philip E. Garrou and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.

MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.

Choice

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Author :
language : en
Publisher:
Release Date : 2001

Choice written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Academic libraries categories.

Robust Electronic Design Reference Book

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Author : John R. Barnes
language : en
Publisher: Springer
Release Date : 2004-03-31

Robust Electronic Design Reference Book written by John R. Barnes and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-03-31 with Technology & Engineering categories.

If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements. Robust Electronic Design Reference Book is an electronics designer's reference library condensed into two volumes. It guides you through the entire process of: -Gathering user requirements. -Developing the design specification. -Partitioning the design into electronics, software, and other technologies. -Designing circuits for signal integrity, EMC, EMI, and ESD. -Choosing components and materials. -Reviewing the design. -Designing printed circuit boards, backplanes, and cables. -Bringing up prototypes. -Testing, characterizing, and refining your design. -Getting approvals. -Putting your product into production, or your equipment into service. Includes over 600 illustrations, nearly 200 tables, and an extensive Glossary and Index.