Electronic Packaging And Interconnection Handbook

DOWNLOAD

Download Electronic Packaging And Interconnection Handbook PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Electronic Packaging And Interconnection Handbook book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page

Electronic Packaging And Interconnection Handbook

DOWNLOAD
Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 2000

Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.

Electronic Packaging And Interconnection Handbook

DOWNLOAD
Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Companies
Release Date : 1991

Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.

Electronic Packaging And Interconnection Handbook 4 E

DOWNLOAD
Author : Charles A. Harper
language : en
Publisher: McGraw Hill Professional
Release Date : 2005

Electronic Packaging And Interconnection Handbook 4 E written by Charles A. Harper and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.

Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

The Electronic Packaging Handbook

DOWNLOAD
Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19

The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Area Array Interconnection Handbook

DOWNLOAD
Author : Karl J. Puttlitz
language : en
Publisher: Springer Science & Business Media
Release Date : 2001

Area Array Interconnection Handbook written by Karl J. Puttlitz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Science categories.

This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractors. In addition, the handbook has individual chapters devoted to supporting disciplines that play a key role in satisfying the requirements of microelectronic package applications: efficient thermal-dissipation techniques, metallurgical and mechanical characteristics of interconnections and electrical design strategies. Area-array technology at both die and chip carrier levels offers the best opportunity of satisfying the demanding performance requirements that users at all levels of the product spectrum have come to expect.

Microelectronics Packaging Handbook

DOWNLOAD
Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31

Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Electronic Connector Handbook

DOWNLOAD
Author : Robert S. Mroczkowski
language : en
Publisher: McGraw Hill Professional
Release Date : 1998

Electronic Connector Handbook written by Robert S. Mroczkowski and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.

Includes data on connectors, this handbook covers the basic functions of connectors and details the range of electronic connectors. It discusses connector parameters in an application context to expedite implementation, and provides design and materials selection criteria for the range of connectors.

Electronic Packaging Of High Speed Circuitry

DOWNLOAD
Author : Stephen G. Konsowski
language : en
Publisher: McGraw Hill Professional
Release Date : 1997

Electronic Packaging Of High Speed Circuitry written by Stephen G. Konsowski and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.

A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.

Electronic Packaging

DOWNLOAD
Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998

Electronic Packaging written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electronic packaging categories.

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Materials For High Density Electronic Packaging And Interconnection

DOWNLOAD
Author : National Research Council
language : en
Publisher: National Academies Press
Release Date : 1990-02-01

Materials For High Density Electronic Packaging And Interconnection written by National Research Council and has been published by National Academies Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-02-01 with Technology & Engineering categories.