Power Electronic Packaging

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Power Electronic Packaging

Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Power Electronics Packaging Reliability

Power Electronics Packaging Reliability written by Mark Johnson and has been published by Energy Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-06-26 with Technology & Engineering categories.

This book describes the technologies involved in power electronic device manufacturing with an emphasis on characterising the key wear-out mechanisms and technologies to increase reliability.

Wafer Level Chip Scale Packaging

Wafer Level Chip Scale Packaging written by Shichun Qu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-10 with Technology & Engineering categories.

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

High Power Electronics Packaging By Transient Liquid Phase Bonding

High Power Electronics Packaging By Transient Liquid Phase Bonding written by Adrian Lis and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.

The International Journal Of Microcircuits And Electronic Packaging

The International Journal Of Microcircuits And Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Electronic packaging categories.

Electronic Packaging And Production

Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Electronic apparatus and appliances categories.

Proceedings Of The International Symposium On Microelectronics

Proceedings Of The International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Hybrid integrated circuits categories.

Journal Of Electronic Packaging

Journal Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Electronic apparatus and appliances categories.

Advances In Electronic Packaging

Advances In Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Electronic packaging categories.

Electrical Performance Of Electronic Packaging

Electrical Performance Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic packaging categories.