Semiconductor Advanced Packaging

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Semiconductor Advanced Packaging

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17

Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Materials For Advanced Packaging

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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18

Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Introduction To Microelectronics Advanced Packaging Assurance

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Author : Navid Asadizanjani
language : en
Publisher: Springer Nature
Release Date : 2025-04-22

Introduction To Microelectronics Advanced Packaging Assurance written by Navid Asadizanjani and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-04-22 with Technology & Engineering categories.

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Chiplet Design And Heterogeneous Integration Packaging

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2023-03-27

Chiplet Design And Heterogeneous Integration Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-03-27 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Iti Submission To The Risks In The Semiconductor Manufacturing And Advanced Packaging Supply Chain

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Author :
language : en
Publisher:
Release Date : 2021

Iti Submission To The Risks In The Semiconductor Manufacturing And Advanced Packaging Supply Chain written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021 with Semiconductor industry categories.

While ITI represents the breadth of the technology sector and counts several leading global semiconductor manufacturers amongst our membership, our response is informed by an end-user perspective on the importance of semiconductors to our industry. Semiconductors represent the foundational building blocks of – and serve as a fundamental enabler of – information and communications technology (ICT) products and services across our industry, products and services which in turn are integral to driving economic and innovative activity across most industries and sectors.

Semiconductor Packaging

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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2011-10-10

Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-10 with Technology & Engineering categories.

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Advances In Electronic Packaging

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Author :
language : en
Publisher:
Release Date : 1999

Advances In Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Electronic packaging categories.

Embedded And Fan Out Wafer And Panel Level Packaging Technologies For Advanced Application Spaces

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Author : Beth Keser
language : en
Publisher: John Wiley & Sons
Release Date : 2021-12-06

Embedded And Fan Out Wafer And Panel Level Packaging Technologies For Advanced Application Spaces written by Beth Keser and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-06 with Technology & Engineering categories.

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Semiconductor International

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Author :
language : en
Publisher:
Release Date : 2004

Semiconductor International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Semiconductor industry categories.

Thermomechanical Simulation Methodologies For Advanced Semiconductor Packaging

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Author : Shuye Zhang
language : en
Publisher: IET
Release Date : 2025-06-15

Thermomechanical Simulation Methodologies For Advanced Semiconductor Packaging written by Shuye Zhang and has been published by IET this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-06-15 with Computers categories.

There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.