Multi Physics Modeling Of Technological Systems
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Multi Physics Modeling Of Technological Systems
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Author : Marc Budinger
language : en
Publisher: John Wiley & Sons
Release Date : 2019-07-09
Multi Physics Modeling Of Technological Systems written by Marc Budinger and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-07-09 with Technology & Engineering categories.
The development of mechatronic and multidomain technological systems requires the dynamic behavior to be simulated before detailed CAD geometry is available. This book presents the fundamental concepts of multiphysics modeling with lumped parameters. The approach adopted in this book, based on examples, is to start from the physical concepts, move on to the models and their numerical implementation, and finish with their analysis. With this practical problem-solving approach, the reader will gain a deep understanding of multiphysics modeling of mechatronic or technological systems – mixing mechanical power transmissions, electrical circuits, heat transfer devices and electromechanical or fluid power actuators. Most of the book's examples are made using Modelica platforms, but they can easily be implemented in other 0D/1D multidomain physical system simulation environments such as Amesim, Simulink/Simscape, VHDL-AMS and so on.
Multiphysics Modelling And Simulation For Systems Design And Monitoring
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Author : Mohamed Haddar
language : en
Publisher: Springer
Release Date : 2015-01-03
Multiphysics Modelling And Simulation For Systems Design And Monitoring written by Mohamed Haddar and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-01-03 with Technology & Engineering categories.
This book reports on the state of the art in the field of multiphysics systems. It consists of accurately reviewed contributions to the MMSSD’2014 conference, which was held from December 17 to 19, 2004 in Hammamet, Tunisia. The different chapters, covering new theories, methods and a number of case studies, provide readers with an up-to-date picture of multiphysics modeling and simulation. They highlight the role played by high-performance computing and newly available software in promoting the study of multiphysics coupling effects, and show how these technologies can be practically implemented to bring about significant improvements in the field of design, control and monitoring of machines. In addition to providing a detailed description of the methods and their applications, the book also identifies new research issues, challenges and opportunities, thus providing researchers and practitioners with both technical information to support their daily work and a new source of inspiration for their future research.
Multiphysics Modeling
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Author : Murat Peksen
language : en
Publisher: Academic Press
Release Date : 2018-06-27
Multiphysics Modeling written by Murat Peksen and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-06-27 with Technology & Engineering categories.
Multiphysics Modelling: Materials, Components, and Systems focuses on situations where coupled phenomena involving a combination of thermal, fluid, and solid mechanics occur. Important fundamentals of the various physics that are required in multiphysics modelling are introduced and supported with practical problems. More advanced topics such as creep deformation, fatigue and fracture, multiphase flow or melting in porous media are tackled. 3D interactions in system architectures and energy systems such as batteries, reformer or fuel cells, and modelling of high-performance materials are exemplified. Important multiphysics modelling issues are highlighted. In addition to theory, solutions to problems, such as in linear and non-linear situations are addressed, as well as specific solutions for multiphysics modelling of fluid-solid, solid-solid and fluid-fluid interactions are given. Drawing on teaching experience, industry solutions, and the latest research, this book is the most complete guide to multiphysics modelling available for students and researchers in diverse science and engineering disciplines. - Provides a thorough intro to the theory behind multiphysics modeling - Covers both linear and non-linear material behaviors - Helps to answer practical questions such as when to use 2D or 3D modeling
Multiphysics Modeling Numerical Methods And Engineering Applications
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Author : Qun Zhang
language : en
Publisher: Elsevier
Release Date : 2015-12-15
Multiphysics Modeling Numerical Methods And Engineering Applications written by Qun Zhang and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-12-15 with Technology & Engineering categories.
Multiphysics Modeling: Numerical Methods and Engineering Applications: Tsinghua University Press Computational Mechanics Series describes the basic principles and methods for multiphysics modeling, covering related areas of physics such as structure mechanics, fluid dynamics, heat transfer, electromagnetic field, and noise. The book provides the latest information on basic numerical methods, also considering coupled problems spanning fluid-solid interaction, thermal-stress coupling, fluid-solid-thermal coupling, electromagnetic solid thermal fluid coupling, and structure-noise coupling. Users will find a comprehensive book that covers background theory, algorithms, key technologies, and applications for each coupling method. - Presents a wealth of multiphysics modeling methods, issues, and worked examples in a single volume - Provides a go-to resource for coupling and multiphysics problems - Covers the multiphysics details not touched upon in broader numerical methods references, including load transfer between physics, element level strong coupling, and interface strong coupling, amongst others - Discusses practical applications throughout and tackles real-life multiphysics problems across areas such as automotive, aerospace, and biomedical engineering
Proceedings Of The Asme Design Engineering Technical Conferences
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Author :
language : en
Publisher:
Release Date : 2007
Proceedings Of The Asme Design Engineering Technical Conferences written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Computer-aided design categories.
Computational Methods In Applied Sciences
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Author : Agnieszka Szczotok
language : en
Publisher: Trans Tech Publications Ltd
Release Date : 2015-01-12
Computational Methods In Applied Sciences written by Agnieszka Szczotok and has been published by Trans Tech Publications Ltd this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-01-12 with Technology & Engineering categories.
Selected, peer reviewed papers from the International Conference on Computational Methods in Applied Sciences (CMAS 2014), December 17-18, 2014, Kraków, Poland
Modeling And Parametric Performance Analysis Of Field Emission Electric Propulsion
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Author : Dinaol Gadisa
language : en
Publisher: GRIN Verlag
Release Date : 2023-03-22
Modeling And Parametric Performance Analysis Of Field Emission Electric Propulsion written by Dinaol Gadisa and has been published by GRIN Verlag this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-03-22 with Technology & Engineering categories.
Master's Thesis from the year 2023 in the subject Engineering - Aerospace Technology, grade: 3,4, , language: English, abstract: Space electric propulsion is required not only for orbit raising and transfer, position control, and station keeping, but also for spacecraft attitude control, advanced thermal material testing, and end-of-life de-orbiting that is much more fuel efficient than conventional chemical rockets. FEEP thruster is one type of ion propulsion system that provides a low thrust of the order of micro-Newton (μN) to milli-Newton (mN) that is primarily used for precise spacecraft attitude control with extremely high efficiency and small impulse bits based on the exhaust velocity of an ejected ion from a thruster. This thesis report includes a mathematical and 3D CAD model of a FEEP thruster with the overarching goal of investigating and analyzing the thruster’s parametric performance. To accomplish this, a MATLAB program was used to simulate the change in thrust and exhaust velocity over time using various types of liquid metal as a propellant, assuming the fuel mass is equal to the atomic mass of the propellant, the wet mass of the spacecraft is assumed to be 4kg, and the charge of an ion is assumed to be 1.602 × 10−19 while the supplied voltage is held constant at 10 kV. Furthermore, because the porous crown emitter is the heart of the FEEP thruster, its stiffness and topology optimization were investigated. The simulation results show that the thrust value of the FEEP thruster over time ranges from 0.213μN to 211mN during stable ion flow rate and mass expulsion of indium propellant, implying that the result is comparable to realistic FEEP parameters. Furthermore, as expected, increasing the voltage between the emitter and extractor electrodes and decreasing the mass expulsion of the propellant increased the thrust value of the FEEP thruster.
Enabling Technologies For 3 D Integration Volume 970
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Author : Christopher A. Bower
language : en
Publisher:
Release Date : 2007-03-30
Enabling Technologies For 3 D Integration Volume 970 written by Christopher A. Bower and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-03-30 with Computers categories.
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
Multiphysics Modeling Using Comsol A First Principles Approach
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Author : Roger W. Pryor
language : en
Publisher: Jones & Bartlett Publishers
Release Date : 2009-12-07
Multiphysics Modeling Using Comsol A First Principles Approach written by Roger W. Pryor and has been published by Jones & Bartlett Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-07 with Technology & Engineering categories.
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Multiphysics Simulation
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Author : Ercan M. Dede
language : en
Publisher: Springer
Release Date : 2014-05-28
Multiphysics Simulation written by Ercan M. Dede and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-05-28 with Computers categories.
This book highlights a unique combination of numerical tools and strategies for handling the challenges of multiphysics simulation, with a specific focus on electromechanical systems as the target application. Features: introduces the concept of design via simulation, along with the role of multiphysics simulation in today’s engineering environment; discusses the importance of structural optimization techniques in the design and development of electromechanical systems; provides an overview of the physics commonly involved with electromechanical systems for applications such as electronics, magnetic components, RF components, actuators, and motors; reviews the governing equations for the simulation of related multiphysics problems; outlines relevant (topology and parametric size) optimization methods for electromechanical systems; describes in detail several multiphysics simulation and optimization example studies in both two and three dimensions, with sample numerical code.