Modeling And Simulation For Microelectronic Packaging Assembly

DOWNLOAD

Download Modeling And Simulation For Microelectronic Packaging Assembly PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Modeling And Simulation For Microelectronic Packaging Assembly book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page

Modeling And Simulation For Microelectronic Packaging Assembly

DOWNLOAD
Author : Shen Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2011-05-17

Modeling And Simulation For Microelectronic Packaging Assembly written by Shen Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-17 with Technology & Engineering categories.

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Modeling And Simulation For Microelectronic Packaging Assembly

DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2011

Modeling And Simulation For Microelectronic Packaging Assembly written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.

Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture

DOWNLOAD
Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23

Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study

Wireless Medical Systems And Algorithms

DOWNLOAD
Author : Pietro Salvo
language : en
Publisher: CRC Press
Release Date : 2017-11-22

Wireless Medical Systems And Algorithms written by Pietro Salvo and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-11-22 with Technology & Engineering categories.

Wireless Medical Systems and Algorithms: Design and Applications provides a state-of-the-art overview of the key steps in the development of wireless medical systems, from biochips to brain–computer interfaces and beyond. The book also examines some of the most advanced algorithms and data processing in the field. Addressing the latest challenges and solutions related to the medical needs, electronic design, advanced materials chemistry, wireless body sensor networks, and technologies suitable for wireless medical devices, the text: Investigates the technological and manufacturing issues associated with the development of wireless medical devices Introduces the techniques and strategies that can optimize the performances of algorithms for medical applications and provide robust results in terms of data reliability Includes a variety of practical examples and case studies relevant to engineers, medical doctors, chemists, and biologists Wireless Medical Systems and Algorithms: Design and Applications not only highlights new technologies for the continuous surveillance of patient health conditions, but also shows how disciplines such as chemistry, biology, engineering, and medicine are merging to produce a new class of smart devices capable of managing and monitoring a wide range of cognitive and physical disabilities.

The International Journal Of Microcircuits And Electronic Packaging

DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2002

The International Journal Of Microcircuits And Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electronic packaging categories.

Mechanics Of Microelectronics

DOWNLOAD
Author : G.Q. Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-08-25

Mechanics Of Microelectronics written by G.Q. Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-08-25 with Technology & Engineering categories.

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Modeling And Simulation For Microelectronic Packaging And Integration

DOWNLOAD
Author : 刘胜
language : en
Publisher:
Release Date : 2021

Modeling And Simulation For Microelectronic Packaging And Integration written by 刘胜 and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021 with Microelectronic packaging categories.

Electronic And Photonics Packaging

DOWNLOAD
Author :
language : en
Publisher: American Society of Mechanical Engineers
Release Date : 2007

Electronic And Photonics Packaging written by and has been published by American Society of Mechanical Engineers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Technology & Engineering categories.

Proceedings Of The Technical Conference

DOWNLOAD
Author :
language : en
Publisher:
Release Date : 1992

Proceedings Of The Technical Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Electronic packaging categories.

5th Electronics Packaging Technology Conference

DOWNLOAD
Author : Mahadevan K. Iyer
language : en
Publisher: IEEE Computer Society Press
Release Date : 2003

5th Electronics Packaging Technology Conference written by Mahadevan K. Iyer and has been published by IEEE Computer Society Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.