Microelectronic Failure Analysis Techniques
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Microelectronic Failure Analysis Techniques
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Author : Ed Doyle (Jr.)
language : en
Publisher:
Release Date : 1981*
Microelectronic Failure Analysis Techniques written by Ed Doyle (Jr.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1981* with Microelectronics categories.
Microelectronic Failure Analysis Desk Reference
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Author :
language : en
Publisher: ASM International
Release Date : 2001-01-01
Microelectronic Failure Analysis Desk Reference written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-01-01 with Technology & Engineering categories.
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Microelectronics Failure Analysis Techniques
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Author : General Electric Company, Electronics Laboratory
language : en
Publisher:
Release Date : 1980
Microelectronics Failure Analysis Techniques written by General Electric Company, Electronics Laboratory and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1980 with Fracture mechanics categories.
The objective of this procedural guide was not to present an expose of device failure modes/mechanisms and applicable techniques for detection, identification and measurement but rather to provide a treatise on proven failure analysis techniques, equipment, procedures and expected analytical results. The guide thus represents a compilation and description of practical semiconductor failure analysis techniques rather than failure analysis flow sequences for verifying specific device failure mechanisms. (Author).
Microelectronic Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2002-01-01
Microelectronic Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-01-01 with Technology & Engineering categories.
Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Microelectronics Fialure Analysis Desk Reference Seventh Edition
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Author : Tejinder Gandhi
language : en
Publisher: ASM International
Release Date : 2019-11-01
Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-01 with Technology & Engineering categories.
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Microelectronics Failure Analysis
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Author : Tejinder Gandhi
language : en
Publisher:
Release Date : 2019
Microelectronics Failure Analysis written by Tejinder Gandhi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Electronic apparatus and appliances categories.
Microelectronic Failure Analysis
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Author : Richard J. Ross
language : en
Publisher: ASM International(OH)
Release Date : 1999
Microelectronic Failure Analysis written by Richard J. Ross and has been published by ASM International(OH) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Education categories.
Forty-seven papers on electronics failure analysis provide an overview for newcomers to the field and a reference tool for the experienced analyst. Topics include electron/ion bean-based techniques, deprocessing and sample preparation, and physical/chemical defect characterization. For the fourth ed
Electronic Failure Analysis Handbook
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Author : Perry L. Martin
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1999
Electronic Failure Analysis Handbook written by Perry L. Martin and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Electronic Failure Analysis Handbook
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Author : Perry L. Martin
language : en
Publisher: McGraw Hill Professional
Release Date : 1999
Electronic Failure Analysis Handbook written by Perry L. Martin and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Failure Analysis
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Author : Marius Bazu
language : en
Publisher: John Wiley & Sons
Release Date : 2011-03-08
Failure Analysis written by Marius Bazu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-08 with Technology & Engineering categories.
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.