Memory Microprocessor And Asic

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Memory Microprocessor And Asic

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Author : Wai-Kai Chen
language : en
Publisher: CRC Press
Release Date : 2003-03-26

Memory Microprocessor And Asic written by Wai-Kai Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-03-26 with Technology & Engineering categories.

Timing, memory, power dissipation, testing, and testability are all crucial elements of VLSI circuit design. In this volume culled from the popular VLSI Handbook, experts from around the world provide in-depth discussions on these and related topics. Stacked gate, embedded, and flash memory all receive detailed treatment, including their power cons

U S Industrial Outlook

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Author :
language : en
Publisher:
Release Date : 1993

U S Industrial Outlook written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Industrial statistics categories.

Presents industry reviews including a section of "trends and forecasts," complete with tables and graphs for industry analysis.

Multi Chip Module Test Strategies

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Author : Yervant Zorian
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Multi Chip Module Test Strategies written by Yervant Zorian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Interfacing To The Powerpc Microprocessor

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Author : Ron Rahmel
language : en
Publisher: Sams
Release Date : 1995

Interfacing To The Powerpc Microprocessor written by Ron Rahmel and has been published by Sams this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Computers categories.

Geared towards those programmers who wish to write code that must interact directly with hardware, this book provides in-depth coverage on the PowerPC hardware configuration and how to interface bus cards, network/external interfaces as well as stand alone system design. More than just an introduction to the technology, this book is a how to manual to maximizing your PowerPC.

Maintain And Repair Your Computer Printer And Save A Bundle

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Author : Stephen J. Bigelow
language : en
Publisher: McGraw-Hill Companies
Release Date : 1992

Maintain And Repair Your Computer Printer And Save A Bundle written by Stephen J. Bigelow and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Computers categories.

How to troubleshoot and repair each of the four central sections of every printer--print head mechanisms, power supplies, electronics, and mechanics. Includes a glossary and a source list for components and repair tools. Annotation copyrighted by Book News, Inc., Portland, OR

Design Of 3d Integrated Circuits And Systems

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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03

Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Science categories.

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Designing Asics

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Author : Paul Naish
language : en
Publisher:
Release Date : 1988

Designing Asics written by Paul Naish and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.

Electronic Design

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Author :
language : en
Publisher:
Release Date : 1996

Electronic Design written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Electronic apparatus and appliances categories.

The Ieee Asia Pacific Conference On Asics

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Author :
language : en
Publisher:
Release Date : 1999

The Ieee Asia Pacific Conference On Asics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Application specific integrated circuits categories.

Ieee International Workshop On Rapid Systems Prototyping

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Author : IEEE Computer Society. Technical Committee on Simulation
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 1999

Ieee International Workshop On Rapid Systems Prototyping written by IEEE Computer Society. Technical Committee on Simulation and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Computers categories.

Contains papers from a June 1999 workshop which brought together system designers, model and tool developers, integrated circuit designers, and software engineers to explore problems and techniques in the area of rapid system prototyping. Papers focus on models for system simulation/emulation in a hierarchical sense, software-to- hardware mapping, software prototyping and validation, prototyping environments of hardware simulators, and experiences from specific system prototyping projects. Contains sections on communication and distributed systems, reconfigurable architectures, reuse, formal methods, design methodologies, interface technologies, and FPGA-based design. Lacks a subject index. Annotation copyrighted by Book News, Inc., Portland, OR.