Materials Reliability In Microelectronics Iv

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Materials Reliability In Microelectronics Iv

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Author : Materials Research Society. Spring Meeting
language : en
Publisher:
Release Date : 1994

Materials Reliability In Microelectronics Iv written by Materials Research Society. Spring Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Electrodiffusion categories.

Materials Reliability In Microelectronics Iv

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Author : Materials Research Society
language : en
Publisher: Materials Research Society
Release Date : 1994-01-01

Materials Reliability In Microelectronics Iv written by Materials Research Society and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-01-01 with Technology & Engineering categories.

Constrained Deformation Of Materials

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Author : Y.-L. Shen
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-08-09

Constrained Deformation Of Materials written by Y.-L. Shen and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-08-09 with Technology & Engineering categories.

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

Applied Mechanics Reviews

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Author :
language : en
Publisher:
Release Date : 1994

Applied Mechanics Reviews written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Mechanics, Applied categories.

Handbook For Iii V High Electron Mobility Transistor Technologies

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Author : D. Nirmal
language : en
Publisher: CRC Press
Release Date : 2019-05-14

Handbook For Iii V High Electron Mobility Transistor Technologies written by D. Nirmal and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-14 with Science categories.

This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots

Plastic Deformation Of Ceramics

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Author : R.C. Bradt
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-11

Plastic Deformation Of Ceramics written by R.C. Bradt and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-11 with Science categories.

This proceedings volume, "Plastic Deformation of Ceramics," constitutes the papers of an international symposium held at Snowbird, Utah from August 7-12, 1994. It was attended by nearly 100 scientists and engineers from more than a dozen countries representing academia, national laboratories, and industry. Two previous conferences on this topic were held at The Pennsylvania State University in 1974 and 1983. Therefore, the last major international conference focusing on the deformation of ceramic materials was held more than a decade ago. Since the early 1980s, ceramic materials have progressed through an evolutionary period of development and advancement. They are now under consideration for applications in engineering structures. The contents of the previous conferences indicate that considerable effort was directed towards a basic understanding of deformation processes in covalently bonded or simple oxide ceramics. However, now, more than a decade later, the focus has completely shifted. In particular, the drive for more efficient heat engines has resulted in the development of silicon-based ceramics and composite ceramics. The discovery of high-temperature cupric oxide-based superconductors has created a plethora of interesting perovskite-Iike structured ceramics. Additionally, nanophase ceramics, ceramic thin films, and various forms of toughened ceramics have potential applications and, hence, their deformation has been investigated. Finally, new and exciting areas of research have attracted interest since 1983, including fatigue, nanoindentation techniques, and superplasticity.

Digital Technical Journal Of Digital Equipment Corporation

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Author :
language : en
Publisher:
Release Date : 1985

Digital Technical Journal Of Digital Equipment Corporation written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with DEC computers categories.

Dynamics In Small Confining Systems Iv Volume 543

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Author : J. M. Drake
language : en
Publisher:
Release Date : 1999-07-15

Dynamics In Small Confining Systems Iv Volume 543 written by J. M. Drake and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-07-15 with Science categories.

This book, the fourth in a series from the Materials Research Society, follows the tradition of earlier volumes in the series and covers a broad range of topics relating to structure and dynamics under geometric restrictions. Emphasis is on methods of probing confined systems, diffusion in porous media, polymers and membranes, dielectric and mechanical relaxation in nanopores, rheology and friction studies of embedded liquids, and properties of dendrimer supermolecules. Participants from many varied disciplines share their points of view on the fundamental questions of how spatial restrictions modify a system to behave significantly different than in bulk, how this difference relates to the molecular properties, and how it can be probed.

Proceedings In Print

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Author :
language : en
Publisher:
Release Date : 1995

Proceedings In Print written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Aeronautics categories.

Stress Induced Phenomena In Metallization

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Author : P. S. Ho
language : en
Publisher: A I P Press
Release Date : 1996

Stress Induced Phenomena In Metallization written by P. S. Ho and has been published by A I P Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Science categories.

Annotation Proceedings of the June 1995 workshop, reporting on new and basic results in electromigration and stress-induced void formation. Sections on stress characteristics and void formation in thin films and interconnects, and electromigration and damage mechanisms in interconnects, contain research in areas such as stresses in passivated gold and metal lines; electrical measurement of stress- induced void growth; modeling electromigration in multi-level interconnects; comparison of electromigration in submicron Al(Cu) and Cu thin-film lines; and resistance oscillations induced by DC electromigration. No index. Annotation c. by Book News, Inc., Portland, Or.