Materials Developments In Microelectronic Packaging

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Materials Developments In Microelectronic Packaging

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Author : Prabjit Singh
language : en
Publisher: ASM International(OH)
Release Date : 1991

Materials Developments In Microelectronic Packaging written by Prabjit Singh and has been published by ASM International(OH) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.

The proceedings of the Fourth Electronic Materials and Processing Conference, held in Montreal in 1991, cover the latest developments in multichip modules, surface mount technology, microelectronic interconnections, electronic and fiber optic connectors, and microelectronic corrosion in 53 papers. I

Materials Developments In Microelectronic Packaging

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Author : Prabjit Singh
language : en
Publisher:
Release Date : 1991-01-01

Materials Developments In Microelectronic Packaging written by Prabjit Singh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-01-01 with categories.

Microelectronic Packaging

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Author : M. Datta
language : en
Publisher: CRC Press
Release Date : 2004-12-20

Microelectronic Packaging written by M. Datta and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-20 with Technology & Engineering categories.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Advances In Electronic Packaging

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Author :
language : en
Publisher:
Release Date : 1999

Advances In Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Electronic packaging categories.

Materials Reliability In Microelectronics Viii

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Author : John C. Bravman
language : en
Publisher:
Release Date : 1998

Materials Reliability In Microelectronics Viii written by John C. Bravman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electrodiffusion categories.

Microelectronic Packaging Technology

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Author : Wei T. Shieh
language : en
Publisher: ASM International(OH)
Release Date : 1989

Microelectronic Packaging Technology written by Wei T. Shieh and has been published by ASM International(OH) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Technology & Engineering categories.

Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

Manufacturing Processes And Materials Challenges In Microelectronic Packaging

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Author : American Society of Mechanical Engineers. Winter Annual Meeting
language : en
Publisher: American Society of Civil Engineers
Release Date : 1991

Manufacturing Processes And Materials Challenges In Microelectronic Packaging written by American Society of Mechanical Engineers. Winter Annual Meeting and has been published by American Society of Civil Engineers this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Technology & Engineering categories.

The International Journal Of Microcircuits And Electronic Packaging

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Author :
language : en
Publisher:
Release Date : 2001

The International Journal Of Microcircuits And Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Electronic packaging categories.

Journal Of Electronic Packaging

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Author :
language : en
Publisher:
Release Date : 2003

Journal Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic packaging categories.

Microelectronic Packaging

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Author :
language : en
Publisher: Ifi/Plenum
Release Date : 1979

Microelectronic Packaging written by and has been published by Ifi/Plenum this book supported file pdf, txt, epub, kindle and other format this book has been release on 1979 with Reference categories.

Good,No Highlights,No Markup,all pages are intact, Slight Shelfwear,may have the corners slightly dented, may have slight color changes/slightly damaged spine.