Introduction To Microsystem Packaging Technology

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Introduction To Microsystem Packaging Technology

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Author : Yufeng Jin
language : en
Publisher: CRC Press
Release Date : 2010-09-29

Introduction To Microsystem Packaging Technology written by Yufeng Jin and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-09-29 with Technology & Engineering categories.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Fundamentals Of Microsystems Packaging

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Author : Tummala
language : en
Publisher: McGraw Hill Professional
Release Date : 2001-05-08

Fundamentals Of Microsystems Packaging written by Tummala and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-05-08 with Technology & Engineering categories.

"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing"

Fundamentals Of Microsystems Packaging

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Author :
language : en
Publisher:
Release Date :

Fundamentals Of Microsystems Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Electronic packaging categories.

Mems And Microsystems

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Author : Tai-Ran Hsu
language : en
Publisher: McGraw-Hill Science, Engineering & Mathematics
Release Date : 2002

Mems And Microsystems written by Tai-Ran Hsu and has been published by McGraw-Hill Science, Engineering & Mathematics this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Computers categories.

Microsystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere.

Physics Of Semiconductor Devices

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Author : Vikram Kumar
language : en
Publisher:
Release Date : 2000

Physics Of Semiconductor Devices written by Vikram Kumar and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Semiconductors categories.

Proceedings Of Spie The International Society For Optical Engineering

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Author :
language : en
Publisher:
Release Date : 1997

Proceedings Of Spie The International Society For Optical Engineering written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Micromechanics categories.

Micromachined Devices And Components

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Author :
language : en
Publisher:
Release Date : 1997

Micromachined Devices And Components written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Micromachining categories.

2002 8th International Advanced Packaging Materials Symposium

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Author :
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 2002

2002 8th International Advanced Packaging Materials Symposium written by and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.

This volume originates from the 2002 8th International Advanced Packaging Materials Symposium and covers topics including: bending of bare fibres; bare fibre under the combined action of bending and tension; polymer coated fibres; and solder materials and joints.

Photonic Systems And Applications In Defense And Manufacturing

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Author : Yee-Loy Lam
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 1999

Photonic Systems And Applications In Defense And Manufacturing written by Yee-Loy Lam and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Science categories.

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

A Wireless Microsystem For Continuous Measurement Of Intraocular Pressure

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Author : Woohyek Choi
language : en
Publisher:
Release Date : 2006

A Wireless Microsystem For Continuous Measurement Of Intraocular Pressure written by Woohyek Choi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.