Heterogeneous Integration

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Heterogeneous Integrations

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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03

Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Chiplet Design And Heterogeneous Integration Packaging

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2023-03-27

Chiplet Design And Heterogeneous Integration Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-03-27 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Foundations Of Heterogeneous Integration An Industry Based 2 5d 3d Pathfinding And Co Design Approach

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Author : Farhang Yazdani
language : en
Publisher: Springer
Release Date : 2018-03-12

Foundations Of Heterogeneous Integration An Industry Based 2 5d 3d Pathfinding And Co Design Approach written by Farhang Yazdani and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-12 with Technology & Engineering categories.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

Heterogeneous Integration

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Author : Anis Husain
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 1998

Heterogeneous Integration written by Anis Husain and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

A New Basis For Chemistry A Chemical Philosophy

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Author : Thomas Sterry Hunt
language : en
Publisher:
Release Date : 1891

A New Basis For Chemistry A Chemical Philosophy written by Thomas Sterry Hunt and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1891 with Chemistry, Physical and theoretical categories.

The American Journal Of Science

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Author :
language : en
Publisher:
Release Date : 1887

The American Journal Of Science written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1887 with categories.

The American journal of science and arts

The American Journal Of Science And Arts

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Author :
language : en
Publisher:
Release Date : 1887

The American Journal Of Science And Arts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1887 with categories.

American Journal Of Science

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Author :
language : en
Publisher:
Release Date : 1887

American Journal Of Science written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1887 with categories.

Integrated Optics And Photonic Integrated Circuits

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Author : Giancarlo C. Righini
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 2004

Integrated Optics And Photonic Integrated Circuits written by Giancarlo C. Righini and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

The American Journal Of Science

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Author : Mrs. Gambold
language : en
Publisher:
Release Date : 1887

The American Journal Of Science written by Mrs. Gambold and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1887 with Botany categories.