Flip Chip Technologies

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Flip Chip Technologies

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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996

Flip Chip Technologies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.

A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR

Low Cost Flip Chip Technologies

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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2000

Low Cost Flip Chip Technologies written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Business & Economics categories.

Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.

Flip Chip Technologies And Global Markets

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Author : BCC Research
language : en
Publisher:
Release Date : 2013-12

Flip Chip Technologies And Global Markets written by BCC Research and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12 with categories.

Advanced Flip Chip Packaging

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Author : Ho-Ming Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-20

Advanced Flip Chip Packaging written by Ho-Ming Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-20 with Technology & Engineering categories.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Flip Chip Technologies Tutorial

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Author :
language : en
Publisher:
Release Date : 1999

Flip Chip Technologies Tutorial written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with categories.

Flip Chip Hybrid Bonding Fan In And Fan Out Technology

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2024-05-23

Flip Chip Hybrid Bonding Fan In And Fan Out Technology written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-23 with Technology & Engineering categories.

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

Flip Chip Technologies Tutorial May 6 1999

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Author : Semiconductor Equipment and Materials International
language : en
Publisher:
Release Date : 1999

Flip Chip Technologies Tutorial May 6 1999 written by Semiconductor Equipment and Materials International and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Electronic packaging categories.

Improvement Study Of Solder Bumped Flip Chip Technologies

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Author : Xiaochen Fu
language : en
Publisher:
Release Date : 2005

Improvement Study Of Solder Bumped Flip Chip Technologies written by Xiaochen Fu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Microelectronic packaging categories.

Microengineering Technology For Space Systems

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Author : Henry Helvajian
language : en
Publisher: AIAA
Release Date : 1997

Microengineering Technology For Space Systems written by Henry Helvajian and has been published by AIAA this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.

A follow-on to Micro- and Nanotechnology for Space Systems, this second monograph in the series uses the more universal term microengineering to define the discipline and processes that lead to the development of an integrated and intelligent microinstrument. Microengineering Technology for Space Systems addresses specific issues concerning areas for ASIM application in current space systems, operation in the space environment, ultra-high-density packaging and nonsilicon materials-processing tools, and the feasibility of the nanosatellite concept.

Comparative Analysis Of Flip Chip Technology

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Author : Integrated Circuit Engineering Corporation
language : en
Publisher:
Release Date : 1998

Comparative Analysis Of Flip Chip Technology written by Integrated Circuit Engineering Corporation and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Integrated circuits categories.