Exploring Memory Hierarchy Design With Emerging Memory Technologies

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Exploring Memory Hierarchy Design With Emerging Memory Technologies

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Author : Guangyu Sun
language : en
Publisher:
Release Date : 2013-10-31

Exploring Memory Hierarchy Design With Emerging Memory Technologies written by Guangyu Sun and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-31 with categories.

Emerging Memory Technologies

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Author : Yuan Xie
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-21

Emerging Memory Technologies written by Yuan Xie and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-21 with Technology & Engineering categories.

This book explores the design implications of emerging, non-volatile memory (NVM) technologies on future computer memory hierarchy architecture designs. Since NVM technologies combine the speed of SRAM, the density of DRAM, and the non-volatility of Flash memory, they are very attractive as the basis for future universal memories. This book provides a holistic perspective on the topic, covering modeling, design, architecture and applications. The practical information included in this book will enable designers to exploit emerging memory technologies to improve significantly the performance/power/reliability of future, mainstream integrated circuits.

Sasimi 98

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Author :
language : en
Publisher:
Release Date : 1998

Sasimi 98 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.

High Performance Computer Architecture

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Author : Harold S. Stone
language : en
Publisher: Prentice Hall
Release Date : 1993

High Performance Computer Architecture written by Harold S. Stone and has been published by Prentice Hall this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.

This update of the popular book on computer architecture presents design ideas embodied in many high-performance machines and stresses techniques for evaluating them. Stone develops a proper understanding of the design process by treating the various trade-offs that exist in designing choices, and shows how good designs make efficient use of technology.Features Teaches techniques for the design and analysis of high-performance machines Develops students' intuition for design by treating various tradeoffs that exist in design choices Discusses many important topics: RISC architectures, interconnection meshes, Cache coherent and multiprocessors, and Cache Memory. Includes enhanced descriptions of RISC Processors Expands material on Cache Memory Analysis Current technology in RISC with a focused look on super scalar Additional memory models and techniques for doing Cache design New porposals for coherent memory systems in System C parallel processors Both design and thought problems and problems with limiting parameters are provided 0201526883B04062001

Conference Proceedings

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Author :
language : en
Publisher:
Release Date : 1999

Conference Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Supercomputers categories.

Early System Analysis Of Cache Performance For Risc Systems

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Author : James D. Roberts
language : en
Publisher:
Release Date : 1992

Early System Analysis Of Cache Performance For Risc Systems written by James D. Roberts and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Cache memory categories.

Abstract: "This report presents a prototype early analysis tool for exploring trade-offs in cache architecture and packaging and interconnection (P/I) technology for RISC microprocessor based systems. We define early analysis as the evaluation of system trade-offs, including implementation technology effects, at pre-netlist phases of development. Prior work in cache performance estimation and P/I modeling are combined and extended to be more specific to RISC systems. After describing the model, several case studies are presented. Although limited by the accuracy of the first-order model as well as by assumptions and estimations regarding input data, these studies indicate general trends and quantify several important trade-offs for multi-chip module systems. MCM characteristics favor larger off-chip caches, with improved performance as well as yield advantages. When combined with flip-chip mounting, MCM technology also permits cache system architectural changes which can significantly improve performance. The prototype is not intended as a design tool, but rather to demonstrate the utility and importance of an interactive early analysis tool, combining architecture and implementation technology issues. Suggestions for future tool development are made."

Proceedings Of Asp Dac Vlsi Design 2002

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Author :
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 2002

Proceedings Of Asp Dac Vlsi Design 2002 written by and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Computers categories.

Papers from a January 2002 conference are organized into four sessions each on low power design, synthesis, testing, layout, and interconnects and technology, as well as two sessions each on embedded systems, verification, and VLSI architecture, one session on analog design, and one session on hot c

3d Ic Stacking Technology

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Author : Banqiu Wu
language : en
Publisher: McGraw Hill Professional
Release Date : 2011-10-14

3d Ic Stacking Technology written by Banqiu Wu and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-14 with Technology & Engineering categories.

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Proceedings Of The Asp Dac Asia And South Pacific Design Automation Conference

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Author :
language : en
Publisher:
Release Date : 2002

Proceedings Of The Asp Dac Asia And South Pacific Design Automation Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with CAD/CAM systems categories.

Fifth International Conference On Massively Parallel Processing

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Author : Lennart Johnsson
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 1998

Fifth International Conference On Massively Parallel Processing written by Lennart Johnsson and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Computers categories.

This text covers the subjects of computer architecture and parallel and high-performance computing. Topics include: free-space optical interconnect systems; design and analysis of optical interconnects; interconnect system analysis; and fiber-based interconnects.