Enabling Technologies For High Bandwidth Applications

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Enabling Technologies For High Bandwidth Applications

Enabling Technologies For High Bandwidth Applications written by Jacek Maitan and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.

Enabling Technologies For High Bandwidth Applications

Enabling Technologies For High Bandwidth Applications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with categories.

Through Silicon Vias For 3d Integration

Through Silicon Vias For 3d Integration written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-08-05 with Technology & Engineering categories.

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Enabling Technologies For 3 D Integration Volume 970

Enabling Technologies For 3 D Integration Volume 970 written by Christopher A. Bower and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-03-30 with Computers categories.

An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.

Proceedings Of The International Symposium On Power Semiconductor Devices And Ics

Proceedings Of The International Symposium On Power Semiconductor Devices And Ics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Integrated circuits categories.

Proceedings Acm International Conference On Multimedia

Proceedings Acm International Conference On Multimedia written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Information storage and retrieval systems categories.

Optical Engineering

Optical Engineering written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Optical instruments categories.

Proceedings Of The 5th Workshops On Enabling Technologies Infrastructure For Collaborative Enterprises Wet Ice 96

Proceedings Of The 5th Workshops On Enabling Technologies Infrastructure For Collaborative Enterprises Wet Ice 96 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Computer conferencing categories.

Storage Technology Assessment

Storage Technology Assessment written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computer storage devices categories.

Directory Of Published Proceedings

Directory Of Published Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Engineering categories.