2002 International Symposium On Microelectronics
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Proceedings 2002 International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 2002
Proceedings 2002 International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Microelectronics categories.
Reliability Of Rohs Compliant 2d And 3d Ic Interconnects
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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2010-10-22
Reliability Of Rohs Compliant 2d And 3d Ic Interconnects written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-22 with Technology & Engineering categories.
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration
Index Of Conference Proceedings
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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 2003
Index Of Conference Proceedings written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Conference proceedings categories.
2002 International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 2002
2002 International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electronic ceramics categories.
Ieee Cpmt International Electronics Manufacturing Technology Symposium
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Author :
language : en
Publisher:
Release Date : 2003
Ieee Cpmt International Electronics Manufacturing Technology Symposium written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic apparatus and appliances categories.
Proceedings Of The Ieee International Symposium On Electronics And The Environment
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Author :
language : en
Publisher:
Release Date : 1995
Proceedings Of The Ieee International Symposium On Electronics And The Environment written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electronic apparatus and appliances categories.
Proceedings
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Author :
language : en
Publisher:
Release Date : 2003
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Integrated circuits categories.
International Conference On Thin Film Physics And Applications
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Author :
language : en
Publisher:
Release Date : 2004
International Conference On Thin Film Physics And Applications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Thin films categories.
Transactions
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Author : Indian Ceramic Society
language : en
Publisher:
Release Date : 2002
Transactions written by Indian Ceramic Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Pottery categories.
Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits
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Author :
language : en
Publisher:
Release Date : 2003
Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Integrated circuits categories.