2000 International Symposium On Microelectronics

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2000 International Symposium On Microelectronics

2000 International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Electronic ceramics categories.

Index Of Conference Proceedings

Index Of Conference Proceedings written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Conference proceedings categories.

Proceedings

Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Integrated circuits categories.

International Symposium On Advanced Packaging Materials

International Symposium On Advanced Packaging Materials written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Electronic packaging categories.

International Symposium On Electronic Materials And Packaging

International Symposium On Electronic Materials And Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.

Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.

Itherm 2002

Itherm 2002 written by Cristina H. Amon and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.

Reliability Of Rohs Compliant 2d And 3d Ic Interconnects

Reliability Of Rohs Compliant 2d And 3d Ic Interconnects written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-22 with Technology & Engineering categories.

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Memoirs Of The Institute Of Scientific And Industrial Research Osaka University

Memoirs Of The Institute Of Scientific And Industrial Research Osaka University written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.

Journal Of Electronic Packaging

Journal Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Electronic packaging categories.

Itherm

Itherm written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Electronic apparatus and appliances categories.